Contact
Contact
RAFI Group

Contact to Team EMS 

T +49 751 89-0

sales.ems@remove-this.rafi-group.com

Phone Link

MANUFACTURING EXPERTISE

YOUR PRODUCTION IN GOOD HANDS
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Your production is in the best possible hands, whatever quantities you require. Our expertise in all current technologies ensures you always receive the excellent quality you expect from RAFI.  

It makes sense to benefit from our manufacturing know-how. We reduce your costs and time-to-market.

We focus on vertical integration: RAFI operates more than 15 fully automatic SMD assembly lines with nitrogen reflow and vapor phase technology for SMD high-speed and fine assembly. We also deliver the high RAFI quality you expect in the processing of THT components using ten wave-soldering systems, four selective soldering machines, and two automatic assembly lines. In addition, extensive machinery is available with loading and magazine equipment, stencil printing machines, inline AOI systems, cutting-bending machines, dual-head riveting machines, depaneling machines, sequencers, lift-dip soldering, press-fit technology presses, cleaning systems, electronic-glass assemblies and all equipment for the assembly of complete assemblies. We also offer microelectronics production in clean rooms with chip-on-board in aluminum and gold wirebond technology and flip chip assembly. The processes are designed for processing a wide range of PCB technologies, such as multilayer, Rogers, aluminum-core, flex, semi-flex and rigid-flex PCBs. This is how we meet both your requirements and our standards quickly and reliably – also with regard to safety. We operate ultramodern clean rooms for this purpose.

SMT and THT assembly

RAFI operates more than 15 fully automatic lines with nitrogen reflow and vapor phase technology for SMD high-speed and precision assembly. With 18 partially automated wave-soldering and selective-soldering systems, we deliver the high RAFI quality you expect, also for the assembly of THT components.

COMPONENT SPECTRUM

We have exactly the components you need, from the smallest resistors to large special parts.

Chip on board - miniaturization

Chip on Board, Chip on Flex, Chip on Chip (Bonden) und Flip Chip

  • Wafer sizes: 2“ - 12“
  • Placement accuracy (XY):  +/- 7µm @3s
  • Working area: 325mm x 200mm
  • Component sizes: 0.2mm - 50mm
PAINTING AND FINISHING

Protective coatings for assemblies are part of our daily business. The same applies to the finishing of your products and the cleaning of electronic assemblies – naturally also in series production.

CASTING AND HOT MELT

Of course, we at RAFI also handle the casting of electronics fully automatically, as an integrated and efficient part of the process. This is how we are facing up to future challenges.

QUALITY ASSURANCE

Long before the testing of finished assemblies, we optimize the PCB layout with you to ensure optimum assembly and function. Then, during production, testing in all process steps guarantees the desired quality.

COMPLETE ASSEMBLY

We take care of the complete assembly of your product – including packaging. It’s a matter of course for us, bringing cost and time savings in one for you.

TOOLSHOP

From simple devices to highly complex automation units. We develop, design, and implement everything ourselves.

TRACEABILITY

Traceability is among our top priorities. We achieve it with 2D laser barcodes on the PCB. The result: fully transparent, controlled, and traceable process step.

For more information about the manufacturing company, please click here:

To RAFI ELTEC GmbH
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